6 位 WCO 子目 · 全球统一
848640本章注释十一(c)所列机器及装置
Machines and apparatus specified in Note 11(c) to this Chapter
12 国进口税率对照
HS 子目 848640 在 12 个主要贸易管辖区的首要进口税率对照
澳大利亚 具体税号
7 个细分税号
| HS 编码 | 商品描述 | 首要税率 |
|---|---|---|
| 84864010 | Machines and apparatus, as follows:machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads;soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices | Free |
| 84864020 | Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | Free |
| 84864031 | Injection or compression moulds for rubber or plastics, other than goods of 8486.40.10 | 5%DCS:4%DCT:5%From 1 July 2019:Free |
| 84864039 | Other | 5%DCS:4%DCT:5%From 1 July 2018:2.5%From 1 July 2019:Free |
| 84864040 | Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process | Free |
| 84864091 | Machinery for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays | From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free |
| 84864099 | Other | 5%From 1 July 2018:3.75%From 1 July 2019:Free |