澳大利亚 · 品目· 5 个子目· 29 个税号

8486半导体、集成电路或平板显示器制造用机器及装置;零件、附件

Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(c) to this chapter; parts and accessories

子目(6 位 WCO 统一)

澳大利亚税号(8 位)

本品目下 澳大利亚海关的全部细分税号与首要税率

HS 编码商品描述首要税率
84861010Machines and apparatus, as follows:for growing or pulling monocrystal semiconductor boules;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spin dryers for semiconductor wafer processing;sawing machines for sawing monocrystal semiconductor boules into slices;grinding, polishing or lapping machines;industrial or laboratory electric furnaces or ovensFree
84861030Machines and apparatus, NSA, for the treatment of materials by a process involving a change of temperature5%DCS:4%DCT:5%From 1 July 2018:3.75%From 1 July 2019:Free
84861090Other5%From 1 July 2018: 3.75%From 1 July 2019: Free
84862010Machines and apparatus, as follows:appliances (including spraying appliances) for wet-etching, developing, stripping or cleaning semiconductor wafers;physical deposition apparatus (including apparatus for deposition by sputtering) on semiconductor wafers;chemical vapour deposition apparatus;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);epitaxial deposition machines;industrial or laboratory electric furnaces or ovens;spinners for coating photographic emulsions on semiconductor wafers;for dry-etching patterns on semiconductor materials;ij. ion implanters for doping semiconductor materials;apparatus for the projection or drawing of circuit patterns on sensitised semiconductor materials;sawing machines for sawing wafers into chips;dicing machines for scribing or scoring semiconductor wafersFree
84862020Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00Free
84862040Centrifuges, including centrifugal dryersFrom 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free
84862090Other5%From 1 July 2018:3.75%From 1 July 2019:Free
84863010Goods, as follows:apparatus for wet-etching, developing, stripping or cleaning of flat panel displays;apparatus and equipment for projection, drawing or plating circuit patterns, used for the manufacture of flat panel displays;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spinners for coating photographic emulsionsFree
84863030Mechanical appliances for projecting, dispersing or spraying liquids, for use in the manufacture of flat panel displays, NSA5%DCS:4%DCT:5%From 1 July 2018:3.75%From 1 July 2019:Free
84863040Centrifuges, including centrifugal dryers5%DCS:4%DCT:5%From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free
84863090Other5%From 1 July 2018:3.75%From 1 July 2019:Free
84864010Machines and apparatus, as follows:machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads;soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devicesFree
84864020Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00Free
84864031Injection or compression moulds for rubber or plastics, other than goods of 8486.40.105%DCS:4%DCT:5%From 1 July 2019:Free
84864039Other5%DCS:4%DCT:5%From 1 July 2018:2.5%From 1 July 2019:Free
84864040Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating processFree
84864091Machinery for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displaysFrom 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free
84864099Other5%From 1 July 2018:3.75%From 1 July 2019:Free
84869010Of goods of 8486.10.10, 8486.20.10, 8486.30.10 and 8486.40.10, other than goods of 8486.90.40Free
84869020Of goods of 8486.10.20, 8486.20.20, 8486.30.20 and 8486.40.205%From 1 July 2018:3.75%From 1 July 2019:Free
84869030Of goods of 8486.20.30 and 8486.40.35%DCS:4%DCT:5%From 1 July 2018:2.5%From 1 July 2019:Free
84869040Of soldering, brazing or welding machines of a kind described in 85155%CA:FreeFrom 1 July 2018:2.5%CA:FreeFrom 1 July 2019:Free
84869050Of machine-tools of a kind described in 8464, NSAFree
84869060Of goods of 8486.30.30 or 8486.40.405%From 1 July 2018:3.75%From 1 July 2019:Free
84869070Which, but for the operation of Note 11(D) to this Chapter, would be classified in 8466.10.00, 8466.20.00 or 8466.30.00Free
84869091Of goods of 8486.10.30From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free
84869092Of goods of 8486.20.40 or 8486.30.405%From 1 July 2018:2.5%From 1 July 2019:Free
84869093Of goods of 8486.40.91From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free
84869099Other5%From 1 July 2018:3.75%From 1 July 2019:Free
澳大利亚 HS 8486 · 半导体、集成电路或平板显示器制造用机器及装置;零件、附件 · Treayo · 全球关税