6 位 WCO 子目 · 全球统一
848640本章注释十一(c)所列机器及装置
Machines and apparatus specified in Note 11(c) to this Chapter
12 国进口税率对照
HS 子目 848640 在 12 个主要贸易管辖区的首要进口税率对照
韩国 具体税号
19 个细分税号
| HS 编码 | 商品描述 | 首要税率 |
|---|---|---|
| 8486401010 | Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates | 0 |
| 8486401020 | Focused ionic-beam milling machines for removing or repairing mask and reticle | 0 |
| 8486401030 | Machines of coating, developing or stabilizing photoresist | 0 |
| 8486401040 | Machines and apparatus for etching, cleaning or stripping mask and reticle | 0 |
| 8486401090 | Other | 0 |
| 8486402010 | Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors | 0 |
| 8486402020 | Machines for inserting or removing semiconductor devices | 0 |
| 8486402031 | Encapsulation equipment for assembly of semiconductors | 0 |
| 8486402039 | Other | 0 |
| 8486402040 | Machines to attach solder ball on semiconductor circuit board or ceramic board | 0 |
| 8486402070 | Moulds for rubber or plastics of injection or compression types | 0 |
| 8486402080 | Machines for bonding semiconductor die, washing wafers, carrier or tube | 0 |
| 8486402091 | Machine-tools (including presses) for working metal by bending, folding, straightening, flattening, for semiconductor leads, whether or not numerically controlled | 0 |
| 8486402093 | Machines for forming connections(bump) on an entire wafer before dicing | 0 |
| 8486402095 | Resistance heated electric furnaces and ovens | 0 |
| 8486402099 | Other | 0 |
| 8486403010 | Automated machines and apparatus for transport, handling and storage of semiconductor wafers, wafer cassettes, boxes and other material for semiconductor devices | 0 |
| 8486403020 | For lifting, handling, loading or unloading of flat panel display | 0 |
| 8486403090 | Other | 0 |